Advanced packaging and assembly for:
- Optoelectronic components
- Photonic devices
- Optical fiber assemblies
- MEMS
- Sensors
Technologies applied to packaging include
- Automation of assembly, alignment, testing and calibration
- Passive alignment including design and implementation of etched silicon substrates
- Active alignment - both one time and continuous including MEMS, electromagnetic and piezoelectric actuation
- State-of-the-art materials and structures for bonding and laser welding
Materials selection
- To meet hermetic requirements
- For high reliability
- To enhance ease of assembly
Thermomechanical analysis
- Heat sink design
- Thermal profiling
- Materials compatibility analysis
- Assembly and operational thermal budget determination
- Major stress point investigation
Intellectual property analysis
- Patent /application searches
- Prior art investigations
- Patent vs. trade secret evaluations
- Infringement potential review
Quality assurance
- Quality control system development
- ISO qualification preparation
- Manufacturing methods for quality assurance
Reliability analysis
- Failures-in-time (FIT) rate prediction
- Telcordia requirements, methodology, and qualification
Research program development
- For small companies desiring to establish basic knowledge for product development
- To allow protection of intellectual property (IP)
- With methods for selection of projects, management, reporting structure, evaluation techniques, project evolution and innovation path control
- To incorporate government funding opportunities
Market analysis
- With market need/competition/strategy analysis
- To meet customer requirements
- With inclusion of special requirements for telecom and datacom applications
Optical design for photonic and optoelectronic components
- Design for performance and assembly
- Trade-off analysis
Aspects of microwave electronics
- Packaging
- Power transfer
- Physical electronics and semiconductor power sources
Power conversion research and development
- Batteries
- Fuel cells
Light source hardware
- Selection of light sources for spectral characteristics (Visable, UV, IR, and other specific bands)
- Specification of operation and control electronics
- Lamp materials and chemistry
- Electrodeless lighting technology